MPC5645S datasheet(65/146 Pages) FREESCALE

65 / 146 page

Qorivva MPC5645S Microcontroller Data Sheet, Rev. 8

Freescale Semiconductor

4.5.1

General notes for specifications at maximum junction temperature

An estimate of the chip junction temperature, TJ, can be obtained from the equation:

TJ = TA + (RJA * PD)

Eqn. 1

where:

TA= ambient temperature for the package (

oC)

RJA= junction to ambient thermal resistance (

oC/W)

PD= power dissipation in the package (W)



D Junction to Package Top Natural Convec-

tion5

—

°C/W

D3.14

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC

specification for this package.

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package.

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used

for the case temperature. Reported value includes the thermal resistance of the interface layer.

5 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as

Psi-JT.

Table 15. Thermal characteristics for 416-pin TEPBGA1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

SpecID

RJA

D Junction to Ambient Natural Convection2

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Single layer board - 1s

°C/W

D3.15

RJA

D Junction to Ambient Natural Convection2

Four layer board - 2s2p

°C/W

D3.16

RJMA

D Junction to Ambient2

@200 ft./min., single layer

board - 1s

°C/W

D3.17

RJMA

D Junction to Ambient2

@200 ft./min., Four layer

board - 2s2p

°C/W

D3.18

RJB

D Junction to Board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package.

—

°C/W

D3.19

RJCtop

D Junction to Case (Top)4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used

for the case temperature. Reported value includes the thermal resistance of the interface layer.

—

°C/W

D3.20



D Junction to Package Top Natural Convec-

tion5

5 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

—

°C/W

D3.21

Table 14. Thermal characteristics for 208-pin LQFP1 (continued)

Symbol

Parameter

Conditions

Value

Unit

SpecID

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