SW38-2G datasheet(26/116 Pages) AAVID

26 / 116 page

EUROPE

ASIA

Italy Tel: +39 051 764011 email: sales.it@aavid.com

United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com

Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg

Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw

AMERICA

USA Tel: +1 (603) 224-9988 email: info@aavid.com

www.aavidthermalloy.com

FIGURE A

SMT Footprints

10.67

(0.420)

15.49

(0.610)

10.41

(0.410)

2.29

(0.090)

7.62

(0.300)

15.49

(0.610)

1.40

(0.060)

0.80

(0.030)

FIGURE B

FIGURE D

FIGURE C

16.76

(0.660)

2.54

(0.100)

10.67

(0.420)

20.32

(0.800)

2.54

(0.100)

Recommended copper heat speader drain pad footprint

Recommended heat sink solder mask opening

Note: The thickness of

the drain pad is variable

depending on the amount

of heat generated by the

SMT device, design limita-

tions and process.

Part Number

“L”

“W”

573100

9.53 (0.375)

13.97 (0.550)

573300

14.22 (0.560)

16.26 (0.640)

573400

14.22 (0.560)

21.08 (0.830)

Part Number

“L”

“W1”

“W2”

573100

9.02 (0.355)

13.46 (0.530)

8.89 (0.350)

573300

13.72 (0.540)

15.75 (0.620)

11.18 (0.440)

573400

13.72 (0.540)

20.57 (0.810)

16.00 (0.630)

Recommended copper pad size

for heat sink and device mounting footprint

For D Pak (TO-263)

For MO-184 and SO-10

Recommended copper pad size

for heat sink and device mounting footprint

SW38-2G 데이터시트(PDF) 26 Page - Aavid, Thermal Division of Boyd Corporation

SW38-2G 데이터시트(HTML) 26 Page - Aavid, Thermal Division of Boyd Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL