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SCBU045 데이터시트(PDF) 13 Page - Texas Instruments |
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SCBU045 데이터시트(HTML) 13 Page - Texas Instruments |
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13 / 30 page ![]() www.ti.com Mechanical Wafer Specification Table 2-5. Mechanical Wafer Specification After Grinding, Sawing on FFC Parameter Value Backside Material Si Roughness: Ra 500 Å Rtm 2500 Å Product Thickness RF-HDT-SJLS-G1 150 μm ± 5 μm RF-HDT-AJLS-G1 Figure 2-1. Wafer on FFC SCBU045 (11-09-21-065) – October 2007 Specification 13 Submit Documentation Feedback |
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