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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SCBU045 데이터시트(PDF) 14 Page - Texas Instruments |
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SCBU045 데이터시트(HTML) 14 Page - Texas Instruments |
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14 / 30 page  www.ti.com 2.3 Mechanical Die Specification Mechanical Die Specification Table 2-6. Mechanical Die Specification Parameter Value Bond pad metallization material ALCu 0.5 % Bond pad metallization thickness 0.95 μm Bond and test pad location Table 2-7 Die dimension (including scribe line) 1080 * 1080 μm ±15 μm Die dimension (excluding scribe line) 996 * 996 μm ±15 μm Top side passivation material SiNi Passivation thickness 1.1 μm Table 2-7. Antenna and Test Pad Location Pad No. Name LLCx[ μm] LLCy[ μm] URCx[ μm] URCy[ μm] 1 ANT1 30 30 n.a. n.a. 2 ANT2 n.a. n.a. 966 966 Test pad 3 TDAT 118 866 168 936 4 GND 836 60 886 130 Figure 2-2. Antenna and Test Pad Location Specification 14 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback |
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