BAT48_11 datasheet(4/8 Pages) STMICROELECTRONICS

4 / 8 page

Characteristics

BAT48

4/8

Doc ID 12634 Rev 2

Figure 3.

Reverse leakage current versus

reverse applied voltage

(typical values)

Figure 4.

Reverse leakage current versus

junction temperature

(typical values)

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

I (µA)

V (V)

T =25°C

T =125°C

T =100°C

T =75°C

T =50°C

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

I (µA)

T (°C)

V =40V

Figure 5.

Junction capacitance versus

reverse applied voltage

(typical values)

Figure 6.

Forward voltage drop versus

forward current (typical values)

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

0.0

0.2

0.4

0.6

0.8

1.0

(A)

(V)

T =125°C

T =25°C

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-323)

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead (SOD-323)

0.01

0.10

1.00

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

Z/R

th(j-a)

SOD-323

Epoxy FR4

= 2.25 mm

= 35 µm

Single pulse

t (s)

epoxy FR4 with recommended pad layout, e

= 35 µm

300

350

400

450

500

550

600

(mm²)

(°C/W)

th(j-a)

printed circuit board, epoxy FR4, e =35 µm

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