Characteristics

STPS5045S

4/7

Doc ID022861 Rev 1

Figure 5.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 6.

Junction capacitance versus

reverse voltage applied

(typical values)

I (mA)

R

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0

5

10

15

20

25

30

35

40

45

V (V)

R

T

j

=150°C

T

C(pF)

100

1000

10000

1

10

100

F=1MHz

V (V)

R

Figure 7.

Forward voltage drop versus

forward current

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under tab

I

(A)

FM

0.1

1.0

10.0

100.0

1000.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

(Maximum values)

V

(V)

FM

(Typical values)

(Typical values)

(Maximum values)

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

epoxy printed circuit board FR4, copper thickness = 35 µm, D PAK

2

S(Cu)(cm²)