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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F103C4 데이터시트(PDF) 77 Page - STMicroelectronics |
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STM32F103C4 데이터시트(HTML) 77 Page - STMicroelectronics |
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77 / 90 page  STM32F103x4, STM32F103x6 Package characteristics Doc ID 15060 Rev 6 77/90 Figure 40. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to the VSS or VDD power pads. It is recommended to connect it to VSS. 3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life. Table 52. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 L 0.300 0.400 0.500 0.0118 0.0157 0.0197 T 0.152 0.0060 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 e 0.500 0.0197 ddd 0.080 0.0031 |
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