STM32F415ZG datasheet(14/186 Pages) STMICROELECTRONICS

14 / 186 page

Communicatio

n interfaces

SPI / I2S

3/2 (full duplex)(2)

I2C

USART/UART

4/2

USB OTG FS

Yes

USB OTG HS

Yes

CAN

SDIO

Yes

Camera interface

Yes

Cryptography

Yes

GPIOs

114

140

12-bit ADC

Number of channels

12-bit DAC

Number of channels

Yes

Maximum CPU frequency

168 MHz

Operating voltage

1.8 to 3.6 V(3)

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package

LQFP64

WLCSP90

LQFP100

LQFP144

LQFP100

LQFP144

UFBGA176

LQFP176

1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip

Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this

package.

2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.

3. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to

Section : Internal reset OFF).

Table 2. STM32F415xx and STM32F417xx: features and peripheral counts

Peripherals

STM32F415RG STM32F415OG STM32F415VG STM32F415ZG STM32F417Vx

STM32F417Zx

STM32F417Ix

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