MPC8280 datasheet(75/83 Pages) FREESCALE

75 / 83 page

MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2

Freescale Semiconductor

Package Description

This figure shows the side profile of the TBGA package to indicate the direction of the top surface view.

Figure 15. Side View of the TBGA Package

This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.

Figure 16. Side View of the PBGA Package Remove

3 Must be pulled down or left floating.

4 If PCI is not desired, must be pulled up or left floating.

5 Sphere is not connected to die.

6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground

signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout

Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to

GND with the noise filtering capacitors.

7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for

external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the

MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.

Soldermask

Copper Traces

Die

Copper Heat Spreader

(Oxidized for Insulation)

1.27 mm Pitch

Glob-Top Dam

Wire Bonds

Etched

Pressure Sensitive

Die

Glob-Top Filled Area

Polymide Tape

Cavity

Adhesive

Attach

View

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

Resin glass epoxy

Plated substrate via

MPC8280 데이터시트(PDF) 75 Page - Freescale Semiconductor, Inc

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