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82563EB 데이터시트(PDF) 45 Page - Intel Corporation

부품명 82563EB
상세설명  82563EB/82564EB Gigabit Platform LAN Connect
PDF  52 Pages
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제조업체  INTEL [Intel Corporation]
홈페이지  http://www.intel.com
Logo INTEL - Intel Corporation

82563EB 데이터시트(HTML) 45 Page - Intel Corporation

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82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon
39
5.2
Thermal Specifications
The 82563EB/82564EB device is specified for operation when the ambient temperature (TA) is
within the range of 0° C to 60° C.
The maximum junction temperature is 120° C. The maximum ambient temperature with airflow
and/or a heatsink can be calculated using the thermal coefficient data below and the power
specification (see section 4.7)
TC (case temperature) is calculated using the equation:
TC = TA + P (θJA - θJC)
TJ (junction temperature) is calculated using the equation:
TJ = TA + P θJA
P (power consumption) is calculated by using the typical ICC, as indicated in Table 38, and nominal
VCC. The preliminary thermal resistances are shown in Table 38.
Table 38. Thermal Characteristics
Value @ Given Airflow (m/s)
Symbol
Parameter
0
1
2
3
Units
θJ
A
Thermal Resistance, Junction to Ambient
26.1
22.9
21.7
21.1
°C/watt
θJ
C
Thermal Resistance, Junction to Case
12.7
-
-
-
°C/watt



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