TMP451

SBOS686 – JUNE 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

TWO-WIRE

PRODUCT

DESCRIPTION

ADDRESS

Single Channel

TMP451

Remote Junction

1001 100

Temperature Sensor

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

Power supply, V+

–0.3 to +3.6

V

Pins 4, 6, 7, and 8 only

–0.3 to +3.6

V

Input voltage

Pin 2 only

–0.3 to (V+) + 0.3

V

Pin 3 only

–0.3 to +0.3

V

Input current

10

mA

Operating temperature range

–55 to +127

°C

Storage temperature range

–60 to +150

°C

+150

°C

Human body model (HBM)

3000

V

Electrostatic

discharge (ESD) Charged device model (CDM)

1000

V

ratings

Machine model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

THERMAL INFORMATION

TMP451

DQF (DFN)

UNITS

8 PINS

Junction-to-ambient thermal resistance

171.3

Junction-to-case (top) thermal resistance

81.4

Junction-to-board thermal resistance

137.9

°C/W

Junction-to-top characterization parameter

3.9

Junction-to-board characterization parameter

140

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: TMP451