STM32F030R8 datasheet(66/88 Pages) STMICROELECTRONICS

66 / 88 page

Electrical characteristics

STM32F030x4 STM32F030x6 STM32F030x8

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DocID024849 Rev 1

Figure 20. ADC accuracy characteristics

Figure 21. Typical connection diagram using the ADC

Refer to Table 48: ADC characteristics for the values of RAIN, RADC and CADC.

Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy

this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 10: Power supply

scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as

close as possible to the chip.

1LSBIDEAL

(1) Example of an actual transfer curve

(2) The ideal transfer curve

(3) End point correlation line

ET=Total Unadjusted Error: maximum deviation

between the actual and the ideal transfer curves.

EO=Offset Error: deviation between the first actual

transition and the first ideal one.

EG=Gain Error: deviation between the last ideal

transition and the last actual one.

ED=Differential Linearity Error: maximum deviation

between actual steps and the ideal one.

EL=Integral Linearity Error: maximum deviation

between any actual transition and the end point

correlation line.

4095

4094

4093

4093 4094 4095 4096

(1)

(2)

(3)

VDDA

VSSA

MS19880V1

1LSBIDEAL

4096

VDDA

MS19881V2

VDDA

AINx

IL±1 μA

0.6 V

RAIN(1)

Cparasitic

VAIN

0.6 V

RADC

12-bit

converter

CADC

Sample and hold ADC

converter

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