PCF8574_PCF8574A

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© NXP B.V. 2013. All rights reserved.

Product data sheet

Rev. 5 — 27 May 2013

19 of 33

NXP Semiconductors

PCF8574; PCF8574A

15. Package outline

Fig 18. Package outline SOT38-4 (DIP16)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT38-4

95-01-14

03-02-13

c

(e )

1

A

L

e

D

Z

16

1

9

8

E

pin 1 index

b

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.30

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

0.76

4.2

0.51

3.2

inches

0.068

0.051

0.021

0.015

0.014

0.009

1.25

0.85

0.049

0.033

0.77

0.73

0.26

0.24

0.14

0.12

0.01

0.1

0.3

0.32

0.31

0.39

0.33

0.03

0.17

0.02

0.13

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4