B219

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warpage (SMT)

5. Recommended Soldering Condition (DIP)

6. Cleaning Condition

7. Connection Condition

8. Precations

Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that

there is a return to normal temperature between the first and second cycle.

Note2: The temperature profile indicates the board surface temperature at the point of cintacts with

the connector terminals.

Soldering iron temperature: 290±10ç, Soldering time: Within 3 seconds

0.15 to 0.2mm

Based on both connector edges, 0.03mm max. in the connector center portion

sFlow Condition with Automatic Soldering Tool. Soldering temperature: 250±5ç, Soldering time: Within 10 seconds

sManual Soldering Condition. Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds

Refer to the "Nylon Connector Use Hand book".

Refer to the "Nylon Connector Use Hand book".

Refer to the "Nylon Connector Use Hand book".

BPrecautions

180±10

100

150

200

250

230

Time (S)

temperature (ç)

60s max

Soldering

10s max

100 to 120s

Preheating

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.