| 전자부품 데이터시트 검색엔진 |
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OPA211AI 데이터시트(PDF) 21 Page - Texas Instruments |
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OPA211AI 데이터시트(HTML) 21 Page - Texas Instruments |
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21 / 37 page ![]() Die DieAttach(Epoxy) Leadframe (CopperAlloy) ExposedatBaseofPackage MoldCompound (Plastic) Terminal (b)CutawayView:DRGPackage(DFN-8) MoldCompound(Plastic) LeadframeDiePad ExposedatBaseofthePackage (CopperAlloy) Leadframe(CopperAlloy) IC(Silicon) DieAttach(Epoxy) (a)CutawayView:DDAPackage(SO-8) (c)BottomView DRGPackage (DFN-8) Thermal Pad DDAPackage (SO-8) Thermal Pad OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 Figure 50. Views of Thermally-Enhanced SO-8 and DFN-8 Packages Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): OPA211 OPA2211 |
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