PIN CONFIGURATIONS

1

2

3

4

8

7

6

5

NC

(1)

V+

OUT

NC

(1)

NC

(1)

-IN

+IN

V-

1

2

3

4

8

7

6

5

Shutdown

(3)

V+

OUT

NC

(1)

NC

(1)

-IN

+IN

V-

1

2

3

4

8

7

6

5

Shutdown

(3)

V+

OUT

NC

(1)

NC

(1)

-IN

+IN

V-

Pad

(2)

1

2

3

4

8

7

6

5

V+

OUTB

-INB

+INB

OUTA

-INA

+INA

V-

Pad

(2)

A

B

1

2

3

4

8

7

6

5

V+

OUTB

-INB

+INB

OUTA

-INA

+INA

V-

A

B

Pad

(2)

OPA211

OPA2211

OPA211

OPA211

SO-8

MSOP-8

OPA211

OPA2211

DFN-8 (3mm × 3mm)

DFN-8 (3mm × 3mm)

OPA2211

SO-8 PowerPAD

(1)

NC denotes no internal connection.

(2)

Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat

dissipation and provides specified performance.

(3)

Shutdown function:

•

Device enabled: (V–)

•

Copyright © 2006–2009, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Link(s): OPA211 OPA2211