MPC8314EEC datasheet(72/101 Pages) FREESCALE

부품명	MPC8314EEC

상세설명	PowerQUICC II Pro Processor Hardware Specifications

PDF	101 Pages

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제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

Package and Pin Listings

This figure shows the TDM transmit signal timing.

Figure 58. TDM Transmit Signals

22 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8314E is available in

a thermally enhanced plastic ball grid array (TEPBGA II), see Section 22.1, “Package Parameters for the

MPC8314E TEPBGA II,” and Section 22.2, “Mechanical Dimensions of the TEPBGA II,” for information

on the TEPBGA II.

22.1

Package Parameters for the MPC8314E TEPBGA II

The package parameters are as provided in the following list. The package type is 29 mm

 29 mm,

TEPBGA II.

Package outline

29 mm

 29 mm

Interconnects

620

Pitch

1 mm

Module height (typical)

2.23 mm

Solder balls

96.5 Sn/3.5 Ag (VR package)

Ball diameter (typical)

0.6 mm

TDMxTCK

TDMxTD

TDMxRCK

TDMxTFS (output)

TDMxTFS (input)

tDM

tDM_HIGH

tDM_LOW

tDMIVKH

tDM_OUTAC

tDMFSIXKH

tDMTKHOV

tDMTKHOX

tDM_OUTHI

tDMFSKHOV

tDMFSKHOX

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