Assembly Instructions for SCA6x0 and SCA10x0 series

TN71

VTI Technologies Oy

2/12

www.vti.fi

Rev.1.0

1

Objective

This document provides general guidelines for Printed Circuit Board (PCB) design and assembly of

VTI's surface mountable DIL type of Pre-molded Lead-frame packages (DIL-8 for SCA6x0 series

and DIL-12 for SCA10x0 series).

It should be emphasized that this document serves only as a design guideline to help develop the

optimal assembly conditions. It is essential that users also use their own manufacturing practices

and experience to be able to fulfill the needs of varying end-use applications.

2

VTI'S DIL-8 and DIL-12 packages

The SCA6x0 and SCA10x0 series products are SMD DIL-8 / DIL-12 components, pick-and-place

mountable, and reflow solderable. These components are completely lead-free and designed to

meet the demanding lead free soldering processes. The package consists of a pre-molded plastic

housing, with a copper based lead frame having gull-wing type of leg pins on the side of the

package to provide electrical contact to the PCB. A metal lid is attached to the top of the package.

The DIL-8 and DIL-12 packages are presented in Figure 1.

Figure 1:

Three dimensional views of the DIL-8 and DIL-12 packages.

3

Package Outline and Dimensions

The outline and dimensions for the DIL-8 package are presented in Figure 2.

Figure 2:

Outline and dimensions for DIL-8 package.