SCA720-D01

Murata Electronics Oy

13/13

www.muratamems.fi

Doc. nr. 82171500

Rev.A

Notes:

•

Preheating time and temperatures according to guidance from solder paste

manufacturer.

•

It is important that the part is parallel to the PCB plane and that there is no angular

alignment error from intended measuring direction during assembly process.

•

Wave soldering is not recommended.

•

Ultrasonic cleaning is not allowed. The sensing element may be damaged by an

ultrasonic cleaning process

The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-

020B. The part should be delivered in a dry pack. The manufacturing floor time (out of

bag) in the customer’s end is 168 hours. Maximum soldering temperature is

250 °C/40 sec.

Rework after the initial soldering process is not recommended. Rework can cause heat

build-up to the leg and this heat build-up will cause the housing material to get soft

thus allowing the leg to move. The movement can cause bond wire disconnection

inside the part.