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MPC8247VRTMFA 데이터시트(PDF) 17 Page - Freescale Semiconductor, Inc |
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MPC8247VRTMFA 데이터시트(HTML) 17 Page - Freescale Semiconductor, Inc |
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17 / 61 page ![]() MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3 Freescale Semiconductor 17 Power Dissipation 4.7 References Semiconductor Equipment and Materials International(415) 964-5111 805 East Middlefield Rd. Mountain View, CA 94043 MIL-SPEC and EIA/JESD (JEDEC) Specifications800-854-7179 or (Available from Global Engineering Documents)303-397-7956 JEDEC Specifications http://www.jedec.org 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54. 2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220. 5 Power Dissipation This table provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal management is required to ensure the junction temperature does not exceed the maximum specified value. Also note that the I/O power should be included when determining whether to use a heat sink. For a complete list of possible clock configurations, see Section 7, “Clock Configuration Modes.” Table 8. Estimated Power Dissipation for Various Configurations1 1 Test temperature = 105° C Bus (MHz) CPM Multiplication Factor CPM (MHz) CPU Multiplication Factor CPU (MHz) PINT(W) 2,3 2 P INT = IDD x VDD Watts 3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds: 66.7 MHz = 0.35 W (nominal), 0.4 W (maximum) 83.3 MHz = 0.4 W (nominal), 0.5 W (maximum) 100 MHz = 0.5 W (nominal), 0.6 W (maximum) 133 MHz = 0.7 W (nominal), 0.8 W (maximum) Vddl 1.5 Volts Nominal Maximum 66.67 3 200 4 266 1 1.2 100 2 200 3 300 1.1 1.3 100 2 200 4 400 1.3 1.5 133 2 267 3 400 1.5 1.8 |
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