ADA4666-2ACPZ-R7 datasheet(29/32 Pages) AD

29 / 32 page

Data Sheet

ADA4666-2

Rev. 0 | Page 29 of 32

OUTLINE DIMENSIONS

Figure 91. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

Figure 92. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADA4666-2ACPZ-R7

−40°C to +125°C

8-Lead LFCSP_WD

CP-8-11

A34

ADA4666-2ACPZ-RL

−40°C to +125°C

8-Lead LFCSP_WD

CP-8-11

A34

ADA4666-2ARMZ

−40°C to +125°C

8-Lead MSOP

RM-8

A34

ADA4666-2ARMZ-RL

−40°C to +125°C

8-Lead MSOP

RM-8

A34

ADA4666-2ARMZ-R7

−40°C to +125°C

8-Lead MSOP

RM-8

A34

Z = RoHS Compliant Part.

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

2.44

2.34

2.24

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

0.20 MIN

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