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ADA4666-2ACPZ-R7 데이터시트(PDF) 9 Page - Analog Devices

부품명 ADA4666-2ACPZ-R7
상세설명  18 V, 725 A, 4 MHz CMOS RRIO Operational Amplifier
PDF  32 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
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ADA4666-2ACPZ-R7 데이터시트(HTML) 9 Page - Analog Devices

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Data Sheet
ADA4666-2
Rev. 0 | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
20.5 V
Input Voltage
(V−) − 300 mV to (V+) + 300 mV
Input Current1
±10 mA
Differential Input Voltage
Limited by maximum input
current
Output Short-Circuit
Duration to GND
Refer to the Maximum Power
Dissipation section
Temperature Range
Storage
−65°C to +150°C
Operating
−40°C to +125°C
Junction
−65°C to +150°C
Lead Temperature
(Soldering, 60 sec)
300°C
ESD
4 kV
Human Body Model2
Machine Model3
400 V
Field-Induced Charged-
Device Model (FICDM)4
1.25 kV
1
The input pins have clamp diodes to the power supply pins and to each
other. Limit the input current to 10 mA or less when input signals exceed the
power supply rail by 0.3 V.
2
Applicable standard: MIL-STD-883, Method 3015.7.
3
Applicable standard: JESD22-A115-A (ESD machine model standard of
JEDEC).
4
Applicable Standard JESD22-C101C (ESD FICDM standard of JEDEC).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages using a
standard 4-layer JEDEC board. The exposed pad of the LFCSP
package is soldered to the board.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead MSOP
142
45
°C/W
8-Lead LFCSP
83.5
48.51
°C/W
1
θJC is measured on the top surface of the package.
ESD CAUTION



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