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TLE2082ACDR 데이터시트(PDF) 6 Page - Texas Instruments

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부품명 TLE2082ACDR
상세설명  EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS
PDF  79 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

TLE2082ACDR 데이터시트(HTML) 6 Page - Texas Instruments

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TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2084Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2084. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
+
–
1OUT
1IN +
1IN –
VCC+
(11)
(6)
(3)
(2)
(5)
(1)
(7)
(4)
–
+
2OUT
2IN +
2IN –
VCC –
+
–
3OUT
3IN +
3IN –
(13)
(10)
(9)
(12)
(8)
(14)
–
+
4OUT
4IN +
4IN –
(2)
(1)
(14)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
100
150
(3)



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