AFE4300

SBAS586B – JUNE 2012 – REVISED JUNE 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit

the device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

AFE4300

UNIT

AVDD to AVSS

–0.3 to +4.1

V

Voltage range

Any pin

–0.3 to AVDD + 0.3

V

Diode current at any device pin

±2

mA

+105

°C

–25 to +85

°C

Storage humidity

10% to 90%

Rh

Humand body model (HBM)

2000

V

Electrostatic discharge

ratings

Charged device model (CDM)

1000

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Supply voltage

2

3.6

V

AVSS

Supply voltage

0

V

External clock input frequency

1

MHz

Ambient temperature range

0

+70

°C

THERMAL INFORMATION

AFE4300

PN (TQFP)

UNITS

80 PINS

Junction-to-ambient thermal resistance

50.5

Junction-to-case (top) thermal resistance

14.2

Junction-to-board thermal resistance

25.3

°C/W

Junction-to-top characterization parameter

0.5

Junction-to-board characterization parameter

24.9

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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