4816P-R2R-503 datasheet(60/62 Pages) BOURNS

60 / 62 page

Specifications are subject to change without notice.

336

Solder Paste

Printing

Reflow; Convection,

IR and Vapor Phase

This application note is designed to provide step-by-step processing recommendations. It covers

the popular soldering process currently in use and provides recommendations and cautions for

each step. Since many variations of time, temperature, processes, cleaning agents and board

types in use, you will want to verify your own system. Bourns does not recommend the backside

mounting of passive components.

The process steps, recommendations and cautions are based on Bourns surveys of users, equip-

ment manufacturers and materials suppliers. No warranty expressed or implied is made in regards

to the following recommendations.

GENERAL

Use the optimum

solder paste for the pattern,

printing process, and sol-

der joint quality.

RECOMMENDED

Typical solder paste alloy is

63Sn/37Pb. RMA,No-Clean

or Halide Free Water

Soluble fluxes should be

used.

CAUTION

Since solder paste usually

contains a high percentage

of activators, you must

ensure adequate cleaning

to remove all residues.

Consult your solder paste

supplier for cleaning meth-

ods. When cleaning addi-

tives are needed, only

those that are Halide Free

should be used.

Adhesive

Application

GENERAL

The adhesive must hold the

unit in correct orientation

upon placement and main-

tain the correct position

during any physical han-

dling before the final sol-

dering process.

RECOMMENDED

To assure positional stabili-

ty, place a single dot of

epoxy under the unit.

CAUTION

Use sufficient adhesive to

assure stability through the

cure process.

Avoid overflow of epoxy

onto solder pads and termi-

nal areas.

Excessive curing before

placement may not allow

full seating of the part

causing incomplete solder

connections.

Network

Placement

GENERAL

Use pick-and-place equip-

ment with a vacuum nozzle

ID that allows adequate

suction to pick the unit out

of the pocket cavity.

RECOMMENDED

Ensure nozzle inside diam-

eter and vacuum levels are

adequate to maintain suc-

tion and part alignment.

CAUTION

Ensure parts are placed so

that all leads are centered

on the solder pads.

Align the leads with the sol-

der belt direction of travel

to avoid the part body cre-

ating a thermal shadowing

effect.

Excessive placement force

to the part should be avoid-

ed to minimize the risk of

package damage.

Flux

Application

Flow (Wave)

GENERAL

Use the correct flux to

remove surface oxides,

prevent re-oxidation and

promote wetting.

RECOMMENDED

RMA (Rosin Mildly

Activated) flux or Halide

Free Water Soluble flux is

recommended.

CAUTION

Avoid fluxes with Halide

activators.

Adhesive

Cure

GENERAL

Heat/time cure should be

accomplished using either

an infrared radiation or a

convection oven.

RECOMMENDED

Cure using the temperature

profile specified by the adhe-

sive manufacturer.

CAUTION

Use sufficient cure time to

ensure complete adhesive

transition from fluid to solid.

Care should be taken to

assure the placed units are

not exposed to temperatures

in excess of the manufactur-

er's maximum.

Do not exceed the maximum

temperature rating of the

component.

Epoxy

Soldering And Cleaning Processes

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