PACKAGE OPTION ADDENDUM

www.ti.com

9-Jan-2014

Addendum-Page 2

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

LM317H

ACTIVE

TO

NDT

3

500

Green (RoHS

& no Sb/Br)

AU

Level-1-NA-UNLIM

0 to 125

LM317HP+

LM317H/NOPB

ACTIVE

TO

NDT

3

500

Green (RoHS

& no Sb/Br)

AU

Level-1-NA-UNLIM

0 to 125

LM317HP+

LM317K STEEL

ACTIVE

TO-3

NDS

2

50

TBD

Call TI

Call TI

0 to 125

LM317K

STEELP+

LM317K STEEL/NOPB

ACTIVE

TO-3

NDS

2

50

Green (RoHS

& no Sb/Br)

POST-PLATE

Level-1-NA-UNLIM

0 to 125

LM317K

STEELP+

LM317MDT/NOPB

ACTIVE

TO-252

NDP

3

75

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

0 to 125

LM317

MDT

LM317MDTX/NOPB

ACTIVE

TO-252

NDP

3

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

0 to 125

LM317

MDT

LM317S/NOPB

ACTIVE

DDPAK/

TO-263

KTT

3

45

Pb-Free (RoHS

Exempt)

CU SN

Level-3-245C-168 HR

0 to 125

LM317S

P+

LM317SX/NOPB

ACTIVE

DDPAK/

TO-263

KTT

3

500

Pb-Free (RoHS

Exempt)

CU SN

Level-3-245C-168 HR

0 to 125

LM317S

P+

LM317T

NRND

TO-220

NDE

3

45

TBD

Call TI

Call TI

LM317T P+

LM317T/LF01

ACTIVE

TO-220

NDG

3

45

Pb-Free (RoHS

Exempt)

CU SN

Level-4-260C-72 HR

LM317T P+

LM317T/NOPB

ACTIVE

TO-220

NDE

3

45

Green (RoHS

& no Sb/Br)

CU SN

Level-1-NA-UNLIM

0 to 125

LM317T P+

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)