LM317SSLASHNOPB datasheet(6/40 Pages) TI1

6 / 40 page

LM117, LM317A, LM317-N

SNVS774O – MAY 2004 – REVISED JANUARY 2014

www.ti.com

LM317A and LM317-N ELECTRICAL CHARACTERISTICS

(1)

Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating

Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.

LM317A

LM317-N

Parameter

Conditions

Unit

Min

Typ

Max

Min

Typ

Max

1.238

1.250

1.262

1.25

Reference Voltage

≤ (VIN − VOUT) ≤ 40V,

1.225

1.250

1.270

1.20

1.25

1.30

10 mA

≤ IOUT ≤ IMAX

(1)

0.005

0.01

0.04

Line Regulation

≤ (VIN − VOUT) ≤ 40V

(2)

%/V

0.01

0.02

0.07

0.1

0.5

0.1

0.5

Load Regulation

10 mA

≤ IOUT ≤ IMAX

(1) (2)

0.3

1.5

Thermal Regulation

20 ms Pulse

0.04

0.07

0.04

0.07

%/W

Adjustment Pin Current

100

μA

Adjustment Pin Current

10 mA

≤ IOUT ≤ IMAX

(1)

0.2

μA

Change

≤ (VIN − VOUT) ≤ 40V

Temperature Stability

TMIN ≤ TJ ≤ TMAX

Minimum Load Current

(VIN − VOUT) = 40V

3.5

NDS, KTT Packages

1.5

2.2

3.4

(VIN − VOUT) ≤ 15V

DCY, NDE Packages

1.5

2.2

3.4

1.5

2.2

3.4

NDT Package

0.5

0.8

1.8

0.5

0.8

1.8

Current Limit

NDS, KTT Packages

0.15

0.40

(VIN − VOUT) = 40V

DCY, NDE Packages

0.15

0.40

0.15

0.40

NDT Package

0.075

0.20

0.075

0.20

RMS Output Noise, % of

10 Hz

≤ f ≤ 10 kHz

0.003

VOUT

VOUT = 10V, f = 120 Hz, CADJ = 0 μF

Ripple Rejection Ratio

VOUT = 10V, f = 120 Hz, CADJ = 10 μF

Long-Term Stability

TJ = 125°C, 1000 hrs

0.3

NDS (TO-3) Package

NDE (TO-220) Package

KTT (TO-263) Package

Thermal Resistance,

θJC

°C/W

Junction-to-Case

DCY (SOT-223) Package

23.5

NDT (TO) Package

NDP (TO-252) Package

NDS (TO-3) Package

NDE (TO-220) Package

Thermal Resistance,

θJA

KTT (TO-263) Package (3)

Junction-to-Ambient

°C/W

DCY (SOT-223) Package (3)

140

(No Heat Sink)

NDT (TO) Package

186

NDP (TO-252) Package (3)

103

(1)

IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A

for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum

junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is :

PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).

(2)

Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specifications for thermal regulation.

(3)

When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by

increasing the PC board copper area that is thermally connected to the package. See the APPLICATION HINTS section for heatsink

techniques.

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