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ASM7306C 데이터시트(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM7306C 데이터시트(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() ASM7306C Rev 1.0 2002/09/22 5 1.4 Bonding Diagram Substrate must be connected to GND. ASM7306CPad Location CHIP SIZE: X= 1550+80(um) , Y= 3240+80(um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -664.92 -1211.84 7 TEST 105.44 -1536.52 2 RA2 -664.92 -1339.96 8 COUT 303.96 -1536.52 3 RA1 -662.64 -1536.52 9 VDD 683.04 -1536.52 4 RA0 -468.24 -1536.52 10 RB0 664.92 -1335.52 5 OSC -281.04 -1536.52 11 RB1 664.92 -1217.12 6 GND -111.72 -1536.52 ASM7306C CHIP SIZE: X= 1550+80(um) , Y= 3240+80(um) 224K x 10 bit ROM 6 7 8 9 5 4 1 2 3 10 11 X= 1550+80(um) Y= 3240+80(um) |
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