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AS5055

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

DC supply voltage

-0.3

5.0

V

Value of these process dependent parameters

to be taken from according Process Parameter

document, current version

VDDp

Peripheral supply voltage

-0.3

VDD+0.3

V

Input pin voltage

-0.3

5.0

V

Input current (latchup immunity)

-100

100

mA

Norm: Jedec 78

Electrostatic Discharge

ESD

Electrostatic discharge

±1

-

kV

Norm: MIL 883 E method 3015

Package thermal resistance

-

33.5

°C/W

Velocity=0, Multi Layer PCB;

Jedec Standard Testboard

Continuous Power Dissipation

Total power dissipation

36

mW

Temperature Ranges and Storage Conditions

Storage temperature

-55

125

°C

Package body temperature

260

°C

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%

MSL

Moisture Sensitive Level

3

Represents a maximum floor life time of 168h