AD9524SLASHPCBZ datasheet(12/56 Pages) AD

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AD9524

Data Sheet

Rev. E | Page 12 of 56

ABSOLUTE MAXIMUM RATINGS

Table 17.

Parameter

Rating

VDD3_PLL1, VDD3_PLL2, VDD3_REF,

VDD3_OUT, LDO_VCO to GND

−0.3 V to +3.6 V

REFA, REFA, REFIN, REFB, REFB to GND

−0.3 V to +3.6 V

SCLK/SCL, SDIO/SDA, SDO, CS to GND

−0.3 V to +3.6 V

OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,

OUT3, OUT3, OUT4, OUT4, OUT5, OUT5,

to GND

−0.3 V to +3.6 V

SYNC, RESET, PD to GND

−0.3 V to +3.6 V

STATUS0, STATUS1 to GND

−0.3 V to +3.6 V

SP0, SP1, EEPROM_SEL to GND

−0.3 V to +3.6 V

VDD1.8_OUT, LDO_PLL1, LDO_PLL2 to

GND

2 V

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this specification

is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 18. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

ΨJT1,2

Unit

48-Lead LFCSP,

7 mm ×

7 mm

26.1

1.7

13.8

0.2

°C/W

1.0

22.8

0.2

°C/W

2.5

20.4

0.3

°C/W

Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per MIL-Std 883, Method 1012.1.

Per JEDEC JESD51-8 (still air).

For information about power dissipation, refer to the Power

Dissipation and Thermal Considerations section.

ESD CAUTION

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