Characteristics

STPS1L60

6/10

Doc ID 7504 Rev 8

Figure 19.

Thermal resistance junction to ambient versus copper surface under tab (STmite flat)

Figure 17.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

Figure 18.

Thermal resistance versus lead

length (DO-41)

0

20

40

60

80

100

120

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMA

Scu(cm²)

Rth(j-a)(°C/W)

Epoxy printed circuit board FR4

copper thickness = 35 µm

0

20

40

60

80

100

120

510

15

20

Lleads(mm)

25

Rth(°C/W)

DO-41

Rth(j-a)

Rth(j-l)

0

25

50

75

100

125

150

175

200

225

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

STmite flat

Rth(j-a)(°C/W)

Scu(cm²)

Epoxy printed circuit board FR4

copper thickness = 35 µm