STPS1L60 datasheet(4/10 Pages) STMICROELECTRONICS

4 / 10 page

Characteristics

STPS1L60

4/10

Doc ID 7504 Rev 8

Figure 7.

Non repetitive surge peak forward

current versus overload duration

(maximum values) (SMA)

Figure 8.

Non repetitive surge peak forward

current versus overload duration

(maximum values) (DO-41)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Ta = 25 °C

Ta = 75 °C

Ta = 125 °C

SMA

δ = 0.5

IM(A)

t(s)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

IM(A)

δ = 0.5

DO-41

Ta = 25 °C

Ta = 75 °C

Ta = 125 °C

t(s)

Figure 9.

Non repetitive surge peak forward

current versus overload duration

(maximum values) (STmite flat)

Figure 10.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Tc = 25 °C

Tc = 75 °C

Tc = 125 °C

t(s)

δ = 0.5

IM(A)

STmite flat

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Zth(j-a)/Rth(j-a)

tp(s)

Single pulse

SMA

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

Figure 11.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (DO-41)

Figure 12.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (STmite flat)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

DO-41

Zth(j-a)/Rth(j-a)

tp(s)

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Zth(j-a)/Rth(j-a)

Single pulse

tp(s)

STmite flat

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

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