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HDMP-1012 데이터시트(PDF) 23 Page - Agilent(Hewlett-Packard)

부품명 HDMP-1012
상세설명  4Low Cost Gigabit Rate Transmit/Receive Chip Set
PDF  42 Pages
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제조업체  HP [Agilent(Hewlett-Packard)]
홈페이지  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HDMP-1012 데이터시트(HTML) 23 Page - Agilent(Hewlett-Packard)

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595
Mechanical Dimensions
and Surface Mount
Assembly
Recommendations
Both the HDMP-1012 and HDMP-
1014 are implemented in an
industry standard M-Quad 80
package. The package outline
dimensions conform to JEDEC
plastic QFP specifications and are
shown below in Figure 10. The M-
Quad 80 package material is
aluminum and the leads have
been formed into a “Gull-Wing”
configuration for surface
mounting.
Figure 10. Mechanical Dimensions of HDMP-1012 and HDMP-1014.
We recommend keeping the
package temperature, Tc, below
75
°C. Forced air cooling may be
required.
M-Quad 80 Package Information
Item
Details
Package Material
Aluminum
Lead Finish Material
85/15 Sn/Pb
Lead Finish Thickness
300 - 600
µ inches
Lead Coplanarity
0.004 inches maximum
PIN #1 ID
(0.779
+0.008
-0.002
(0.913 ± 0.004)
(0.543
+0.008
-0.002
(0.677 ± 0.004)
(0.104 ± 0.005)
(0.015 ± 0.002)
(0.014 TYP.)
(0.0315 TYP.)
7 DEG
(0.006)
(0.031 ± 0.005)
23.20 ± 0.10
)
19.786
+0.18
-0.08
17.20 ± 0.10
)
+0.16
-0.04
13.792
2.64 ± 0.13
0.80 TYP.
0.35 TYP.
0.15
0.80 ± 0.13
0.38 ± 0.05
TOP VIEW
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).



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