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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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UPD16675AP 데이터시트(PDF) 32 Page - NEC |
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UPD16675AP 데이터시트(HTML) 32 Page - NEC |
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32 / 36 page  P0.25 ±0.01⋅165 = 41.25±0.05 W0.125±0.02 21.1 ±0.3 (SR) 21.1 ±0.3 (SR) (44.4) (Cut Line) 23.2 23.2 27 63.949 ±0.08 P0.7 ±0.01⋅54 = 37.8±0.055 W0.35±0.02 (40) (Cut Line) 44 25 4 1.5 2.575 ±0.01 1 Cu 1.5 2.575 ±0.01 1.981 ±0.03 (COATING AREA) 0 −4.6 Polymide Adhesive Copper Plating Solder Resist UPILEX-S EPOXY ELECTROLYSIS Cu Sn EPOXY 75 m 12 m 25 m MIN 0.25 m 25 m This Figure is shown by Copper side over Polyimide 5 Sprocket holes (23.75 mm) for 1 Pattern Corner radius is 0.30 mm Max. All tolerances unless otherwise specified 0.05 mm. 17.68 A 22.125 (Mark) 22.125 (Mark) Specification ∝ ∝ ∝ ∝ ∝ φ |
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