TGS2353

DC – 18 GHz High Power SPDT Switch

Mechanical Information

0.175

0.0

0.300

0.925

1.150

0.175 0.300

0.925 0.985

0.0

0.177

0.621

0.826

1.031

1.476

1.652

1.476

1.275

0.377

0.177

1

2 3

4

5

6

7

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: +/- 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Bond Pad

Symbol

Pad Size

1

RF In

0.100 x 0.200

2, 7

Vc2

0.100 x 0.100

3, 6

Vc1

0.100 x 0.100

4

RF Out1

0.200 x 0.100

5

RF Out2

0.200 x 0.100

Preliminary Data Sheet: Rev A 06/20/11

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Disclaimer: Subject to change without notice

© 2011 TriQuint Semiconductor, Inc.