DocID023658 Rev 2

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AN4163

Thermal measurements

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Thermal measurements

In order to check the design reliability, a thermal mapping by means of an IR camera was

done. Figure 42 and Figure 43 show thermal measurements of the on-board components at

nominal input voltages and full load. Some pointers visible on the pictures placed across key

components show the relevant temperature. Table 2 provides the correlation between the

measured points and components, for both thermal maps. The ambient temperature during

both measurements was 25 °C. According to these measurement results, all components of

the board are working within their temperature limits.

AM13427v1

AM13428v1