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AN2846 데이터시트(PDF) 24 Page - STMicroelectronics |
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AN2846 데이터시트(HTML) 24 Page - STMicroelectronics |
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24 / 35 page ![]() Application circuit AN2846 24/35 Doc ID 15130 Rev 1 3.2.1 Footprint The footprint given in Figure 32 allows ground connection optimization of COMP and COMPS. The 1 cm 2 heat sink area defines an R TH-JA of 80 °C/W. Figure 32. Foot print (not to scale) 6.10 8.80 3.50 0.6 11.35 1.35 3.425 1.30 2.575 0.4 0.25 5.00 0.65 Pin 1 Package footprint Additional copper for extra-cooling 0.6 SCOPPER = 100 mm² Copper thickness : 35µm |
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