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AN533 데이터시트(PDF) 12 Page - STMicroelectronics

부품명 AN533
상세설명  The behavior of a semiconductor device depends
PDF  22 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN533 데이터시트(HTML) 12 Page - STMicroelectronics

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Through-hole packages
AN533
12/22
With rivets: Pop rivets should never be used for the following reasons:
●
A too rigorous expansion of the metal can lead to a distortion of the heatsink hole and
induce mechanical stresses on the die.
●
High crimping shock can damage the die.
Press rivets can be used with caution provided they are of a soft metal like aluminium. The
crimping force must be applied slowly and carefully in order to avoid shock and deformation
of the heatsink.
Figure 10.
Assembly with rivet
With clips: Care should be taken with the contact area between the plastic case and the
clip: the maximum pressure allowed on plastic is 150 N/mm2. Over this value, cracks may
be induced in the package. Therefore, the clips have to be round or smooth in the contact
area to avoid concentrated loads on the plastic body. The force applied on the component
depends on the heatsink and the component thickness, so they must be specially designed
to take this value into account. Screw assembly is preferred to clip assembly for insulated
packages.
Figure 11.
Clip assembly
Rivet
Contact
grease
Component
Heatsink
Contact grease
d
Component
Clip
Heatsink



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