| 전자부품 데이터시트 검색엔진 |
|
AN901 데이터시트(PDF) 4 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
AN901 데이터시트(HTML) 4 Page - STMicroelectronics |
|
4 / 14 page ![]() 4/14 EMC GUIDELINES FOR MICROCONTROLLER-BASED APPLICATIONS 3 EMC COMPLIANCE Once the areas involved are identified, EMC performances are improved by decreasing noise source emissions, increasing EMI immunity in susceptible areas and weakening the capacity of noise carriers. 3.1 PRINTED CIRCUIT BOARD For technical reasons, it is best to use a multi-layer printed circuit board (PCB) with a separate layer dedicated to the ground and another one to the VDD supply, which results in a good de- coupling, as well as a good shielding effect. For many applications, economical requirements prohibit the use of this type of board. In this case, the most important feature is to ensure a good structure for the ground and power supply. 3.1.1 Component Position A preliminary layout of the PCB must separate the different circuits according to their EMI con- tribution in order to reduce cross-coupling on the PCB, i.e. noisy, high-current circuits, low- voltage circuits, and digital components. 3.1.2 Ground and Power Supply (V SS, VDD) The GROUND should be distributed individually to every block (noisy, low level sensitive, dig- ital,...) with a single point for gathering all ground returns. Loops must be avoided or have a minimum surface. The power supply should be implemented close to the ground line to mini- mize the surface of the supply loop. This is due to the fact that the supply loop acts as an an- tenna, and is therefore the main emitter and receiver of EMI. All component-free surfaces of the PCB must be filled with additional grounding to create a kind of shielding (especially when using single-layer PCBs). 3.1.3 Decoupling The standard decoupler for microcontrollers is a 100-µF pool capacitor, and in parallel, a 0.1-µF high frequency capacitor (typical values). Aluminium electrolytic capacitors should be avoided due to their poor performance at high frequencies. These capacitors must physically be as close as possible to the VSS/VDD pins of the component in order to reduce the surface of the actual loop. As a general rule, decoupling all sensitive or noisy signals improves EMC performances. There are 2 types of decouplers: – Capacitors close to components. Inductive characteristics, which apply to all capacitors be- yond a certain frequency, must be taken into account. If possible, parallel capacitors with de- creasing values (0.1, 0.01,... µF) should be used. – Inductors. Although often ignored, ferrite beads, for example, are excellent inductors due to their good dissipation of EMI energy and there is no loss of DC voltage (which not the case when simple resistors are used). |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |