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DIM800DDS12-A000 데이터시트(PDF) 3 Page - Dynex Semiconductor |
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DIM800DDS12-A000 데이터시트(HTML) 3 Page - Dynex Semiconductor |
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3 / 8 page ![]() DIM800DDS12-A000 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 3/8 www.dynexsemi.com ELECTRICAL CHARACTERISTICS Tcase = 25°C unless stated otherwise. Symbol Parameter Test Conditions Min Typ Max Units ICES Collector cut-off current VGE = 0V, VCE = VCES 1 mA VGE = 0V, VCE = VCES, Tcase = 125°C 25 mA IGES Gate leakage current VGE = ± 20V, VCE = 0V 4 μA VGE(TH) Gate threshold voltage IC = 40mA, VGE = VCE 4.5 5.5 6.5 V VCE(sat) Collector-emitter saturation voltage VGE = 15V, IC = 800A 2.2 2.8 V VGE = 15V, IC = 800A, Tj = 125°C 2.6 3.2 V IF Diode forward current DC 800 A IFM Diode maximum forward current tp = 1ms 1600 A VF Diode forward voltage IF = 800A 2.1 2.4 V IF = 800A, Tj = 125°C 2.1 2.4 V Cies Input capacitance VCE = 25V, VGE = 0V, f = 1MHz 90 nF Qg Gate charge ±15V 9 μC Cres Reverse transfer capacitance VCE = 25V, VGE = 0V, f = 1MHz nF LM Module inductance – per switch 20 nH RINT Internal transistor resistance – per switch 270 μ SCData Short circuit current, ISC Tj = 125°C, VCC = 900V tp ≤ 10μs, VGE ≤ 15V VCE (max) = VCES – L * x dI/dt IEC 60747-9 4500 A Note: * L is the circuit inductance + L M |
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