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DS111219

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

SBB5000

Notes:

1. All dimensions in inches [millimeters].

2. Die thickness is 0.004 [0.100].

3. Typical bond pad is 0.003x0.006

4. Backside metallization: Gold.

5. Bond pad metallization: Gold.

6. Backside is ground.

Die Dimensions

Pin

Function

Description

RF IN

This pad is DC coupled and matched to 50

. An external DC block is required.

RF OUT

This pad is DC coupled and matched to 50

. DC bias is applied through this pad.

DIE

BACKSIDE

Die backside must be connected to RF/DC ground using silver filled conductive epoxy.