PIC16LC620-04SLASHSS datasheet(99/108 Pages) MICROCHIP

99 / 108 page

Preliminary

DS30235G-page 99

PIC16C62X

14.1

Package Marking Information

20-Lead SSOP

XXXXXXXXXX

AABBCDE

XXXXXXXXXX

XXXXXXXX

AABBCDE

18-Lead CERDIP Windowed

18-Lead SOIC (.300")

XXXXXXXXXXXX

AABBCDE

XXXXXXXXXXXX

XXXXXXXXXXXXXXXXX

AABBCDE

18-Lead PDIP

Example

-04I / 218

9851 CBP

PIC16C622A

16C622

/JW

9801 CBA

Example

-04I / S0218

9818 CDK

PIC16C622

PIC16C622A

-04I / P456

9823 CBA

Example

Legend: MM...M

Microchip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer speciﬁc information.

Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask

rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with

your Microchip Sales Ofﬁce. For QTP devices, any special marking adders are included in QTP price.

PIC16LC620-04/SS 데이터시트(PDF) 99 Page - Microchip Technology

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