PIC16F84A datasheet(43/68 Pages) MICROCHIP

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PIC16F84A

Preliminary

DS35007A-page 43

9.1

DC CHARACTERISTICS:

PIC16F84A-04 (Commercial, Industrial)

PIC16F84A-20 (Commercial, Industrial)

DC Characteristics

Power Supply Pins

Standard Operating Conditions (unless otherwise stated)

Operating temperature

°C ≤ TA ≤ +70°C (commercial)

-40

°C ≤ TA ≤ +85°C (industrial)

Parameter

No.

Sym

Characteristic

Min

Typ† Max Units

Conditions

D001

D001A

VDD

Supply Voltage

4.0

4.5

—

5.5

XT, RC and LP osc conﬁguration

HS osc conﬁguration

D002*

VDR

RAM Data Retention

Voltage (Note 1)

1.5*

—

Device in SLEEP mode

D003

VPOR

VDD Start Voltage to

ensure internal

Power-on Reset signal

—VSS

—

See section on Power-on Reset for details

D004*

D004A*

SVDD

VDD Rise Rate to

ensure internal

Power-on Reset signal

0.05*

TBD

—

V/ms PWRT enabled (PWRTE bit clear)

PWRT disabled (PWRTE bit set)

See section on Power-on Reset for details

D010

D010A

D013

IDD

Supply Current

(Note 2)

—

1.8

4.5

RC and XT osc conﬁguration (Note 4)

FOSC = 4.0 MHz, VDD = 5.5V

(During Flash programming)

HS osc conﬁguration (PIC16F84A-20)

FOSC = 20 MHz, VDD = 5.5V

D020

D021

D021A

IPD

Power-down Current

(Note 3)

—

7.0

1.0

µA

VDD = 4.0V, WDT enabled, industrial

VDD = 4.0V, WDT disabled, commercial

VDD = 4.0V, WDT disabled, industrial

D022*

∆IWDT

Module Differential

Current (Note 5)

Watchdog Timer

—

6.0

—

20*

25*

µA

WDTE bit set, VDD = 4.0V, commercial

WDTE bit set, VDD = 4.0V, extended

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5.0V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD, T0CKI = VDD,

MCLR = VDD; WDT enabled/disabled as speciﬁed.

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.

5: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD measurement.

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