AS3630 datasheet(70/72 Pages) AMSCO

70 / 72 page

AS3630 – 70

8A Supercap Flash Driver

The PCB assembly should be instrumented and the reflow

oven’s process parameters established to ensure the solder

paste manufacturer’s reflow profile specification is met during

the assembly process. See Figure below.

The maximum PCB temperature recommended by the supplier

must not be exceeded.

Figure AS3630 – 57:

Solder Reflow Profile

JEDEC standard Lead-free reflow profile: According to J-STD-020D.

Figure AS3630 – 58:

Recommended Reflow Soldering Profile

Profile Feature

Lead-free Assembly

Average ramp-up rate (Tsmax to TP)

3 °C/second max.

Preheat

•Temperature Min (Tsmin)

•Temperature Max (Tsmax)

•Time (tL)

150 °C

200 °C

60 – 120 seconds

Time maintained above:

•Temperature (TL)

•Time (tL)

217 °C

60 – 150 seconds

Peak/classification temperature (TP)

260 °C

Time within 5 °C of actual peak temperature (TP)

30 seconds

Ramp-down rate

6 °C/second max.

Time 25 °C to peak temperature

8 minutes max.

Soldering Information

Tsmin

Tsmax

t 25°C to Peak Temperature

Ramp Down

Ramp

Critical

Zone

TL to TP

Time [s]

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