ADP5054ACPZ-R7 datasheet(7/31 Pages) AD

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Data Sheet

ADP5054

Rev. B | Page 7 of 31

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter1

Rating

PVIN1 to PGND

−0.3 V to +18 V

PVIN2 to PGND

−0.3 V to +18 V

PVIN3 to PGND3

−0.3 V to +18 V

PVIN4 to PGND4

−0.3 V to +18 V

SW1 to PGND

−0.3 V to +18 V

SW2 to PGND

−0.3 V to +18 V

SW3 to PGND3

−0.3 V to +18 V

SW4 to PGND4

−0.3 V to +18 V

PGND to Ground

−0.3 V to +0.3 V

PGND3 to Ground

−0.3 V to +0.3 V

PGND4 to Ground

−0.3 V to +0.3 V

BST1 to SW1

−0.3 V to +6.5 V

BST2 to SW2

−0.3 V to +6.5 V

BST3 to SW3

−0.3 V to +6.5 V

BST4 to SW4

−0.3 V to +6.5 V

DL1 to PGND

−0.3 V to +6.5 V

DL2 to PGND

−0.3 V to +6.5 V

CFG12, CFG34 to Ground

−0.3 V to +6.5 V

EN1, EN2, EN3, EN4 to Ground

−0.3 V to +6.5 V

VREG to Ground

−0.3 V to +6.5 V

SYNC/MODE to Ground

−0.3 V to +6.5 V

RT to Ground

−0.3 V to +3.6 V

PWRGD to Ground

−0.3 V to +6.5 V

FB1, FB2, FB3, FB4 to Ground 2

−0.3 V to +3.6 V

COMP1, COMP2, COMP3, COMP4 to Ground

−0.3 V to +3.6 V

Storage Temperate Range

−65°C to +150°C

Operational Junction Temperature Range

−40°C to +125°C

The exposed pad is the analog ground for the ADP5054. See Table 6.

The rating for the FB1, FB2, FB3, and FB4 pins applies to the adjustable

output voltage models of the ADP5054.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

48-Lead LFCSP

28.4

10.1

°C/W

ESD CAUTION

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