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STBB3J 데이터시트(PDF) 3 Page - STMicroelectronics

부품명 STBB3J
상세설명  2 A, high efficiency single inductor buck-boost DC-DC converter
PDF  25 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STBB3J 데이터시트(HTML) 3 Page - STMicroelectronics

  STBB3J Datasheet HTML 1Page - STMicroelectronics STBB3J Datasheet HTML 2Page - STMicroelectronics STBB3J Datasheet HTML 3Page - STMicroelectronics STBB3J Datasheet HTML 4Page - STMicroelectronics STBB3J Datasheet HTML 5Page - STMicroelectronics STBB3J Datasheet HTML 6Page - STMicroelectronics STBB3J Datasheet HTML 7Page - STMicroelectronics STBB3J Datasheet HTML 8Page - STMicroelectronics STBB3J Datasheet HTML 9Page - STMicroelectronics Next Button
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STBB3J
List of figures
List of figures
Figure 1.
Application schematic for adjustable output version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2.
Block diagram adjustable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3.
Pin connection top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4.
Pin connection bottom view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5.
Efficiency vs. output current (power save mode enabled VOUT = 3.3 V) . . . . . . . . . . . . . . 11
Figure 6.
Efficiency vs. output current (power save mode disabled VOUT = 3.3 V) . . . . . . . . . . . . . . 11
Figure 7.
Efficiency vs. output current (PWM/auto mode VIN = 1.8 V). . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8.
Efficiency vs. output current (PWM/auto mode VIN = 3.6 V). . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9.
Efficiency vs. output current (PWM/auto mode VIN = 5.0 V). . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 10.
Maximum output current vs. input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 11.
Line transient response @ VIN = 3 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12.
Line transient response @ VIN = 3.6 V to 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13.
Line transient response @ VIN = 3.6 V to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14.
Line transient response @ VIN = 4 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 15.
Load transient response @ VIN= 1.8 V, IOUT = 100 to 300 mA . . . . . . . . . . . . . . . . . . . . . 12
Figure 16.
Load transient response @ VIN = 1.8 V, IOUT = 300 mA to 100 mA . . . . . . . . . . . . . . . . . . 12
Figure 17.
Load transient response @ VIN = 3.6 V, IOUT = 100 to 300 mA . . . . . . . . . . . . . . . . . . . . . 13
Figure 18.
Load transient response @ VIN = 3.6 V, IOUT = 300 mA to 100 mA . . . . . . . . . . . . . . . . . . 13
Figure 19.
Load transient response @ VIN = 5.5 V, IOUT = 100 to 300 mA . . . . . . . . . . . . . . . . . . . . . 13
Figure 20.
Load transient response @ VIN = 5.5 V, IOUT = 300 to 100 mA . . . . . . . . . . . . . . . . . . . . . 13
Figure 21.
Startup after enable @ VIN = 1.8 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 22.
Startup after enable @ VIN = 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 23.
Startup after enable @ VIN = 5.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 24.
Output voltage vs. output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 25.
Auto mode vs. output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 26.
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 27.
Assembly layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 28.
Top layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 29.
Bottom layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 30.
Flip Chip 20 (2.5 x 1.75 mm) outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 31.
Flip Chip 20 (2.5 x 1.75 mm) recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23



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