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LSM6DSMTR 데이터시트(PDF) 1 Page - STMicroelectronics |
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LSM6DSMTR 데이터시트(HTML) 1 Page - STMicroelectronics |
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1 / 113 page  This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. February 2016 DocID028165 Rev 2 1/113 LSM6DSM iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - preliminary data Features Power consumption: 0.4 mA in combo normal mode and 0.65 mA in combo high-performance mode “Always-on” experience with low power consumption for both accelerometer and gyroscope Smart FIFO up to 4 kbyte based on features set Compliant with Android K, L, and M Hard, soft ironing for external magnetic sensor corrections ±2/±4/±8/±16 g full scale ±125/±245/±500/±1000/±2000 dps full scale Analog supply voltage: 1.71 V to 3.6 V Independent IOs supply (1.62 V) Compact footprint, 2.5 mm x 3 mm x 0.83 mm SPI & I2C serial interface with main processor data synchronization feature Dedicated gyroscope low-pass filters for UI and OIS applications Auxiliary dedicated SPI for OIS data output Pedometer, step detector and step counter Significant motion and tilt function Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click Embedded temperature sensor ECOPACK®, RoHS and “Green” compliant Applications Motion tracking and gesture detection Collecting sensor data Indoor navigation IoT and connected devices Intelligent power saving for handheld devices EIS and OIS for camera applications Vibration monitoring and compensation Description The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary dedicated low- pass filtering. High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSM is available in a plastic land grid array (LGA) package. LGA-14L (2.5 x 3 x 0.83 mm) typ. Table 1. Device summary Part number Temp. range [°C] Package Packing LSM6DSM -40 to +85 LGA-14L (2.5x3x0.83mm) Tray LSM6DSMTR -40 to +85 Tape & Reel www.st.com |
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