PACKAGE OUTLINE

DQN0004A

X2SON - 0.4 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4215302/C 11/2015

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4.

Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes.

20

LP5907

SNVS798J – APRIL 2012 – REVISED MARCH 2016

www.ti.com

Product Folder Links: LP5907

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