Data Sheet

ADA8282

Rev. 0 | Page 21 of 21

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

3.50 REF

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.65

3.50 SQ

3.45

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 31. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-11)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADA8282WBCPZ-R7

−40°C to +125°C

32-Lead LFCSP_WQ, 7”Tape and Reel

CP-32-11

ADA8282WBCPZ

−40°C to +125°C

32-Lead LFCSP_WQ

CP-32-11

ADA8282CP-EBZ

Evaluation Board

AUTOMOTIVE PRODUCTS

The ADA8282W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

©2015 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D13132-0-7/15(0)