MB9B520M datasheet(102/113 Pages) SPANSION

102 / 113 page

DataS h eet

March 10, 2015, MB9B520M_DS706-00048-3v0-E

CONFIDENTIAL



Package Dimensions

80-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

12.00 mm × 12.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.47 g

80-pin plastic LQFP

(FPT-80P-M37)

2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2

120

INDEX

*12.00± 0.10(.472 ± .004)SQ

14.00± 0.20(.551 ± .008)SQ

0.50(.020)

0.22± 0.05

(.009± .002)

0.08(.003)

0.145± 0.055

(.006± .002)

0.08(.003)

"A"

(Stand off)

Details of "A" part

(.004 ± .002)

0.10 ± 0.05

(.024 ± .006)

0.60 ± 0.15

(.020 ± .008)

0.25(.010)

0.50 ± 0.20

(Mounting height)

.059–.004

+.008

–0.10

+0.20

1.50

0~8°

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

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